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Specifications |
General | TK-5210 |
Models TK5210K TK-5210K2 TK-5210K3 |
Basic Model
4-key w/LCD Model Full key w/LCD Model |
Frequency Range | 136-174 MHz |
Number of Channels | 512 |
Zones | 50 |
Max. Channels per Zone | 250 |
Channel Spacing Analog Digital |
12.5 / 15 / 20 / 25 / 30 kHz 12.5 kHz |
Operating Voltage | 7.5 VDC � 20% |
Battery life (@5-5-90 duty cycle) KNB-32N, 7.5 VDC, 2500 mAh |
|
Operating temperature range | -22�F ~+ 140� F (-30� C ~ +60� C) |
Frequency stability (-22�F ~+ 140�F) | � 0.00025 % |
Antenna Impedance | 50 Ω |
Dimensions (W x H x D) | 2-5/16 x
6-3/32
x 1-13/16 in.
(58 x 155 x 45.7 mm) |
Weight (Radio
only) TK5210K TK-5210K2 TK-5210K3 |
11.11 oz. (315 g) 11.64 oz. (330 g) 11.64 oz. (330 g) |
Weight (TK-5210K2 withKRA-22 & Belt Clip) | 23.28 oz. (660 g) |
FCC ID | ALH35733110 |
IC certification | 282D-35733110 |
RECEIVER | |
Sensitivity Digital (5 % BER) Digital (1 % BER) Analog (12 dB SINAC) |
0.25 �V 0.40 �V 0.25 �V |
Selectivity Digital Analog @25/30 kHz Analog @12.5 kHz |
-60 dB -78 dB -67 dB |
Intermodulation distortion Digital Analog |
-75 dB -75 dB |
Spurious & Image rejection Digital Analog |
80 dB 80 dB |
Audio Distortion Digital Analog |
Less than 1.5 % Less than 2 % |
Audio output |
500 mW / 8 Ω |
TRANSMITTER | |
RF power output | 5 W / 1 W |
Spurious & harmonics | 70 dB |
FM Hum & Noise Analog @ 25/30 kHz Analog @12.5 kHz |
50 dB |
Audio distortion | Less than 2% |
Modulation | 16K0F3E, 11K0F3E, 8K10F1E, 8K10F1D |
Standard |
MIL
810C Methods/Procedures |
MIL
810D Methods/Procedures |
MIL
810E Methods/Procedures |
MIL
810E Methods/Procedures |
Low Pressure | 500.1/Procedure I | 500.2/Procedure I | 500.3/Procedure I | 500.4/Procedure I, II |
High Temperature | 501 .I/Procedure I, II | 501.2/Procedure I, II | 501.3/Procedure I, II | 501.4/Procedure I, II |
Low Temperature | 502.I/Procedure I | 502.2/Procedure I, II | 502.3/Procedure I, II | 502.4/Procedure I, II |
Temperature Shock | 503.1/Procedure I | 503.2/Procedure I | 503.3/Procedure I | 503.4/Procedure I,II |
Solar Radiation | 505. I/Procedure I | 505.2/Procedure I | 505.3/Procedure I | 505.4/Procedure I |
Rain | 506.1/Procedure I, II | 506.2/Procedure I, II | 506.3/Procedure I, II | 506.4/Procedure I, III |
Humidity | 507.I/Procedure I, II | 507.2/Procedure II | 507.3/Procedure II | 507.4 |
Salt Fog | 509.I/Procedure I | 509.2/Procedure I | 509.3/Procedure I | 509.4 |
Dust | 510.I/Procedure I | 510.2/Procedure I | 510.3/Procedure I | 510.4/Procedure I, III |
Vibration | 514.2/Procedure VIII, X | 514.3/Procedure I | 514.4/Procedure I | 514.5/Procedure I |
Shock | 516.2/Procedure I, II, V | 516.3/Procedure I, IV | 516.4/Procedure I, IV | 516.5/Procedure I, IV |
Immersion (option) | 512.1/Procedure I | 512.2/Procedure I | 512.3/Procedure I | 512.4/Procedure |
WISCO International, Inc. -
MIAMI, FL U.S.A. Fax: (954) 370-3997 | E-mail: wiscointl@wiscointl.com |